Process visual library
Semiconductor Manufacturing
josh@semivisual.com
< select a visualisation >
close ×
FEOL
01
GAA Transistor (FEOL)
147
FinFET Transistor
02
ALD
03
SADP (ALD)
42
Forksheet FET
38
STI & HKMG Gate
39
Wafer Manufacturing
40
SAQP Patterning
41
CFET (Complementary FET)
34
Backside Power (BSPDN)
35
Atomic Layer Etch
36
Selective Epitaxy
37
Ion Implantation
26
EUV Lithography
116
High-NA EUV
117
EUV Photomask
118
EUV Photoresist
119
Process Control · Metrology
22
CMP
MOL / BEOL
04
MEOL Contacts
05
BEOL Metallisation (M0–M2)
06
Dual Damascene
72
Self-Aligned Contacts · COAG
73
Wrap-Around Contact
74
Co / Ru Local Interconnect
75
Subtractive Ru (Semi-Damascene)
76
Self-Aligned Vias (ASD)
77
Air-Gap Interconnects
78
Low-κ / ULK Dielectrics
79
Via Prefill (Hybrid Metal)
80
BEOL MIM Capacitor
81
Passivation · Pad · RDL
Bonding
07
Wire Bonding
08
Flip Chip (C4 / BGA)
09
Flux TCB
10
Fluxless TCB
11
Hybrid Bonding (D2W)
106
Hybrid Bonding (W2W)
Substrate and PCB
12
ABF Substrate (FC-BGA)
13
Multilayer PCB
107
Glass-Core Substrate
Optics
16
Photonic IC
17
Optical Transceiver
18
Traditional Transceiver
19
LPO
20
NPO
21
CPO
113
LRO · Linear Receive
114
XPO · eXtra-dense Pluggable
115
MPO-16 Connector
137
Optical Circuit Switch
138
Hollow-Core · Multi-Core Fibre
45
VCSEL · DFB · PD
57
EML (EA-Modulated Laser)
58
Tunable Laser (ITLA)
59
III-V-on-Si Laser
139
InP Laser Fab
60
TFLN Modulator
61
Comb Laser Source
62
VCSEL Array (LiDAR)
63
EDFA / SOA Amplifiers
Adv. Packaging
43
Underfill · Mould · Dice
30
Fan-Out WLP / InFO
31
EMIB Bridge
23
Through-Si Via (TSV)
24
CoWoS · 2.5D Interposer
98
TSMC SoIC · 3D
131
SoIC-X · Memory on Logic
99
CoWoS-L · LSI + RDL
109
CoWoS-S · Si Interposer
110
CoWoS-R · RDL Interposer
111
EMIB-T · TSV Bridge
112
CoPoS · Chip-on-Panel
132
Direct-to-Chip Liquid Cooling
133
DAF · TIM · Thermal Stack
100
Intel Foveros
101
Fan-In WLCSP
102
Panel-Level (FOPLP)
103
System-on-Wafer
104
Leadframe (SOIC·QFN)
105
Antenna-in-Package
134
Wafer Probe
135
Final Test · SLT · Burn-In
136
Known-Good-Die Flow
Memory
32
3D NAND Flash
127
3D NAND · Channel Hole
29
DRAM Cell (1T1C)
124
DRAM Capacitor · HAR + ALD
108
SRAM (6T Cell)
25
HBM Stack
123
HBM4 · 16-Hi Stack
130
CXL Memory Expander
126
3D DRAM (VS-DRAM)
129
NAND Package · SSD
Components
14
MLCC
15
Memory Buffers (RCD/DB)
33
CMOS Image Sensor
46
Resistors & Inductors
47
Tantalum / Electrolytic Cap
48
Crystal / MEMS Resonator
50
MEMS Sensor
51
RF Front-End Module
44
BAW / SAW Filter
Power
27
SiC Power MOSFET
28
GaN HEMT
49
Power Packaging
88
Si Trench MOSFET
89
Superjunction MOSFET
90
IGBT (Field-Stop)
91
SiC Trench MOSFET
92
SiC Schottky Diode
93
Vertical GaN FET
94
BCD Process (PMIC)
95
DrMOS · Power Stage
96
Isolated Gate Driver
97
Ga₂O₃ Devices
AI Accelerators
52
NVIDIA Hopper H100
53
NVIDIA Blackwell B200
54
NVIDIA Rubin R200
55
Google TPU v7 Ironwood
56
Google TPU v8
64
Google TPU 8i Zebrafish
65
AWS Trainium3
66
Meta MTIA
67
AMD Instinct MI355X
68
Microsoft Azure Maia
69
Intel Gaudi 3
70
Cerebras WSE-3
71
Groq LPU
CPUs
82
NVIDIA Vera
83
AMD EPYC Venice
84
Intel Clearwater Forest
85
AWS Graviton4
86
Google Axion
87
Arm AGI CPU
Data Centre
140
NVL72 Rack Build
141
Rack Power Chain
142
800V Sidecar Rack
143
Rack Power Generations
144
DPU / SmartNIC
Display
145
MicroLED
146
LTPO OLED Backplane